SIPLACE CA2 | High-speed chip assembly directly from wafer and SMT placement in one machine

THE HYBRID SIPLACE CA2 HIGH-SPEED PLATFORM REVOLUTIONIZES SiP PRODUCTION Only consistent miniaturization and increasingly complex electronics make things like smart devices, autonomous driving and the 5G communication standard possible. The key technology is system-in-package (SiP) because it combines ICs and SMT components into a compact, highly innovative system. As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process SMDs supplied from changeover tables and feeders as well as dies taken directly from a sawn wafer in a single workstep. By integrating the complex die bonding process into the SMT line it eliminates the need for special machines in production. Reduced personnel deployment, high connectivity and integrative data utilization make the new SIPLACE CA2 the perfect match for the Intelligent Factory. To find out more about the SIPLACE CA2, please follow this link: